Tag Archives: Coil on Module

exceet Card expands banking business with SECORA™ Pay from Infineon

exceet Card AG is further strengthening its portfolio with SECORA™ Pay security solutions from Infineon Technologies AG. Card manufacturers can easily integrate them thanks to the combination of dual interface chip technology with the award-winning Coil-on-Module (CoM) packages. These also make the card more robust and reliable. “SECORA Pay provides us with certified EMV* solutions […]

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Saving cost with innovative packaging systems

By Helmut Strycek, Infineon Technologies.  Total Cost of Ownership is a key decision making point for governments throughout the world. With different national ID card lifetimes, public sector implementations have to be planned long- term: The investments taken at the start of a project may be higher than, for example, in a singular payment or […]

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Coil on Module for contactless ID documents: complete solution with chip and antenna from a single source

The core of electronic ID cards (eID) and passports are powerful and robust security solutions. Security chips in “Coil-on-Module” (CoM) packages offer significant advantages here. Infineon Technologies AG is now expanding its internationally proven CoM portfolio with a complete solution for contactless ID documents. The new SLC52 security chip is now available, integrated with the […]

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VIDEO: Contactless competence by IFX Austria

Contactless technology for smart card applications, ranging from secure ID to payment and ticketing, has to stay on the cutting edge at all times. With contactless technology smart objects make life convenient for the user, helping governments and private sector businesses to roll out suitable solutions across all applications. Infineon’s contactless competence center is based […]

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Frost & Sullivan awards Infineon’s Coil on Module technology

Based on its recent analysis of the smart card solutions market, Frost & Sullivan recognises Infineon Technologies AG (Infineon) with the 2013 Global Frost & Sullivan Award for New Product Innovation Leadership. Infineon has developed the flexible ‘Coil on Module’ chip package and related card antenna designs to accelerate introduction of cards that can be […]

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Infineon’s Coil-on-Module technology helps to secure contactless payment

Infineon Technologies AG has introduced its ‘Coil on Module’ chip package for Dual Interface bank and credit cards. Dual Interface – used for both contact-based and contactless applications – are a fast growing segment of the global payments industry. The new ‘Coil on Module’ package combines a security chip and antenna that makes a radio […]

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