The Case for the eDatapage

Interview with Philip Seebauer, Infineon Technologies

We spoke to Infineon’s Philip Seebauer and asked why is the structure and material of the eDatapage so important for todays ePassports? The conversation also covers the upsides and downsides of polycarbonate eDatapages as well as Infineon’s contactless Coil-on-Module solution.

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Categories: ePassport, Video


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