SPS “Dual 6” module ready for migration to dual interface cards in the USA

Smart Packaging Solutions has announced that its “Dual 6” and “S-Lams®” technologies are ready for integration for smart card manufacturers to benefit from the massive upcoming migration to dual interface cards in the Americas.  Already, leading financial institutions in the United States are showing interest for dual interface payment cards and plan to introduce them…

VIDEO: Cartes 2015 Infineon and Watchdata on dual interface implementation

How to speed up Dual Interface card implementation – interview with Watchdata and Infineon Outline: What are the advantages of inductive coupling and how can it speed up Dual Interface card implementation? Learn more about the challenges and how they can be met. Speakers: - Wolfgang Schindler, Senior Manager Marketing Secure Mobile and Transaction, Infineon…

Infineon’s Coil-on-Module technology helps to secure contactless payment

Infineon Technologies AG has introduced its 'Coil on Module' chip package for Dual Interface bank and credit cards. Dual Interface – used for both contact-based and contactless applications – are a fast growing segment of the global payments industry. The new 'Coil on Module' package combines a security chip and antenna that makes a radio…