Frost & Sullivan awards Infineon’s Coil on Module technology

Based on its recent analysis of the smart card solutions market, Frost & Sullivan recognises Infineon Technologies AG (Infineon) with the 2013 Global Frost & Sullivan Award for New Product Innovation Leadership. Infineon has developed the flexible 'Coil on Module' chip package and related card antenna designs to accelerate introduction of cards that can be…

Infineon’s Coil-on-Module technology helps to secure contactless payment

Infineon Technologies AG has introduced its 'Coil on Module' chip package for Dual Interface bank and credit cards. Dual Interface – used for both contact-based and contactless applications – are a fast growing segment of the global payments industry. The new 'Coil on Module' package combines a security chip and antenna that makes a radio…