Infineon introduces revolutionary “Coil on Module” for eIDs, eDL or eHealth applications

Infineon Technologies AG today announced the availability of its “Coil on Module” (CoM) package technology for official documents. The technology simplifies and improves manufacturing of electronic identification cards (eID), electronic drivers’ licenses or health insurance cards with both contact-based as well as contactless interface. Holders of these Dual Interface cards are able to use existing…