Written by The Coil on Module (CoM) technology utilized in Turkish passports represents a cutting-edge advancement in electronic data security. Infineon’s CoM CL solution integrates a security chip into a polycarbonate data page, employing a contactless module for heightened protection against forgery and durability.
This innovative technology, with its inductive coupling approach, wirelessly links the module to the document’s embedded antenna, akin to contactless card-reader connections. Infineon’s FCOS™ manufacturing technology further refines this by enabling the creation of a significantly thinner module, just 125 µm thick, enhancing the overall robustness of the passport’s electronic data page.
“At Infineon, we are delighted to continue our role as a trusted partner to Türkiye by consistently integrating our security components into the new government identity eDocuments. Enabled by embedded Infineon components, the new eDatapage is only 630 µm thick, making it one of the thinnest in the world. We are very proud of this attractive and reliable product that represents the next level of document security and design.”
Maurizio Skerlj, Vice President Authentication & Identity Solutions at Infineon’s Connected Secure Systems Division.
Türkiye’s recent issuance of nearly five million of these next-generation passports demonstrates their commitment to providing secure, fraud-resistant travel documents to meet the needs of their growing population. Infineon’s components make the passport’s electronic data page a remarkable 630 µm thin, setting a new standard for thinness and reinforcing its security and durability against potential threats.
This advancement will be showcased at Infineon’s booth at TRUSTECH 2023, demonstrating its excellence in design and its superior security features compared to other passports in circulation. For further details on Coil on Module contactless technology, more information can be found here.